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Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Apple, Inc.ZTE Corp.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.Konica Minolta, Inc.
Interuniversitair Micro-Electronica Centrum VZWBando Chemical Industries Ltd.Palo Alto Research Center, Inc.Fujikura Kasei Co., Ltd.Brewer Science, Inc.CEMEDINE Co., Ltd.InkTec Co., Ltd.NthDegree Technologies Worldwide, Inc.Applied Nanotech Holdings, Inc.24M Technologies, Inc.Canatu OyNCC Nano LLCVorbeck Materials Corp.CorTec GmbHNuovo Film, Inc.The Sixth Element (Changzhou) Materials Technology Co., Ltd.The Sixth Element (Changzhou) Materials Technology Co., Ltd.Plextronics, Inc.Genes'Ink SASWise SrlNanogap Sub NM Powder SAEccrine Systems, Inc.Multi-Fineline Electronix, Inc.Karl Knauer KGInkron Ltd.Enerage, Inc.Next Biometrics Group ASBebop Sensors, Inc.Intrinsiq Materials, Inc.Jujo Chemical Co., Ltd.
Eastman Kodak Co.Dai Nippon Printing Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Fujikura Ltd.SCREEN Holdings Co., Ltd.IBIDEN Co., Ltd.NOK Corp.Nippon Micrometal Corp.Toyo Ink SC Holdings Co. Ltd.Toppan Forms Co. Ltd.Palo Alto Research Center, Inc.Universal Display Corp.Senju Metal Industry Co., Ltd.Cambridge Display Technology Ltd.Draper, Inc.Magna Electronics, Inc.ELNA Co., Ltd.Shenzhen Sunway Communication Co., Ltd.Avary Holding (Shenzhen) Co., Ltd.Shenzhen Sunway Communication Co., Ltd.Avary Holding (Shenzhen) Co., Ltd.Duk San Neolux Co., Ltd.Fujifilm Dimatix, Inc.Sekisui Polymatech Co., Ltd.AT & S Austria Technologie & Systemtechnik AGArisawa Mfg. Co., Ltd.Koh Young Technology, Inc.CMK Corp.Brewer Science, Inc.Stokke AS
TOKAI RIKA CO., LTD.
Liquid Wire, Inc.Liquid X Printed Metals, Inc.Elifeconnection Co., Ltd.PChem Associates, Inc.
ISCAR Ltd.Jinan Iron & Steel Co. Ltd.Jinan Iron & Steel Co. Ltd.Nanjing Iron & Steel Co., Ltd.Ansteel Group Mining Co., Ltd.Nippon Piston Ring Co., Ltd.ENGEL AUSTRIA GmbHPowertech Technology, Inc.Hitachi Powdered Metals Co., Ltd.OSAKA Titanium Technologies Co., Ltd.Lonza, Inc.ALD Vacuum Technologies GmbHLiuzhou Iron & Steel Co., Ltd.Rizhao Steel Holding Group Co., Ltd.Anshan Iron & Steel Group Corp.Hunan Valin Xiangtan Iron & Steel Co., Ltd.Anyang Iron & Steel Co., Ltd.Mpi, Inc.Lunghwa University of Science & TechnologyComadur SAMatsuura Machinery Corp.Hitachi Metals Precision Ltd.MegaGen Implant Co., Ltd.Liuzhou Iron & Steel Co., Ltd.voxeljet AGTaisei Kogyo Co., Ltd.Shougang Shuicheng Iron & Steel (Group) Co., Ltd.OECHSLER AGShougang Shuicheng Iron & Steel (Group) Co., Ltd.Delong Steel Ltd.
