Search results for “Package on package” companies
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Key Players
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Innovation Intensity
With the analysis among 1,734 patents, we discovered top 175 key players by total patent application. Taiwan Semiconductor Manufacturing Co., Ltd., Samsung Electronics Co., Ltd., Intel Corp. are dominant in this area. They take 40.66% of the total patent filing.
Taiwan Semiconductor Manufacturing Co., Ltd.
Taiwan Province, China
Patent: 343
Samsung Electronics Co., Ltd.
South Korea
Patent: 209
Intel Corp.
California, United States
Patent: 153
QUALCOMM, Inc.
California, United States
Patent: 120
Xing Ke Jin Peng You Xian Gong Si
British Virgin Islands
Patent: 73
Samsung Electro-Mechanics Co., Ltd.
Chungcheongnam-do, South Korea
Patent: 55
Apple, Inc.
California, United States
Patent: 51
Adeia Semiconductor Technologies LLC
California, United States
Patent: 39
Micron Technology, Inc.
Idaho, United States
Patent: 35
Powertech Technology, Inc.
Taiwan Province, China
Patent: 34
Startups & Unicorns
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Innovation Intensity
With the analysis among 3 patents, we discovered top 2 start-ups by total patent application.
STARTUP
SJ Semiconductor (Jiangyin) Corp.
Jiangsu Sheng, China
Patent: 2
STARTUP
KIOXIA Corp.
Tokyo-to, Japan
Patent: 1
Fast-Growing
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Innovation in recent 5 years
With the analysis among related 230 patents applied in the last 5 years. We discover 43 most active companies in this area. The fast-growing Taiwan Semiconductor Manufacturing Co., Ltd., Samsung Electronics Co., Ltd., Intel Corp. take 61.74% of patent filing during this period.
Taiwan Semiconductor Manufacturing Co., Ltd.
Taiwan Province, China
Patent: 71
Samsung Electronics Co., Ltd.
South Korea
Patent: 52
Intel Corp.
California, United States
Patent: 19
SK hynix, Inc.
South Korea
Patent: 14
Samsung Electro-Mechanics Co., Ltd.
Chungcheongnam-do, South Korea
Patent: 5
Micron Technology, Inc.
Idaho, United States
Patent: 5
Huawei Technologies Co., Ltd.
Guangdong Sheng, China
Patent: 4
QUALCOMM, Inc.
California, United States
Patent: 4
Murata Manufacturing Co. Ltd.
Kyoto-fu, Japan
Patent: 3
National Center for Advanced Packaging Co. Ltd.
Jiangsu Sheng, China
Patent: 3
New Entrants
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Innovation in recent 5 years
With the analysis among related 230 patents in last 5 years, we discover 21 new entrants. Beijing YanDong Microelectronic Co., Ltd., TSE Co., Ltd., Macronix International Co., Ltd. are the most active new entrants in this area.
Beijing YanDong Microelectronic Co., Ltd.
Beijing Shi, China
Patent: 2
TSE Co., Ltd.
Chungcheongnam-do, South Korea
Patent: 2
Macronix International Co., Ltd.
Taiwan Province, China
Patent: 2
Shenzhen Rewo Micro Semiconductor Technology Co., Ltd.
Guangdong Sheng, China
Patent: 2
HTC Corp.
Taiwan Province, China
Patent: 2
Panasonic Intellectual Property Management Co. Ltd.
Osaka-fu, Japan
Patent: 2
International Business Machines Corp.
New York, United States
Patent: 2
Thales Alenia Space Italia SpA
CITY OF ROME, Italy
Patent: 2
Zhejiang Chituo Technology Co., Ltd.
Zhejiang Sheng, China
Patent: 2
Wenzhou Meifuda Arts & Crafts Co., Ltd.
Zhejiang Sheng, China
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 14 patents, we discovered top 4 universities and scientific research institutions by total patent application. Chongqing Three Gorges University, Changzhou Institute of Technology, Korea Advanced Institute of Science & Technology are dominant in this area. They take 71.43% of the total patent filing.
Chongqing Three Gorges University
Chongqing Shi, China
Patent: 2
Changzhou Institute of Technology
Jiangsu Sheng, China
Patent: 1
Korea Advanced Institute of Science & Technology
South Korea
Patent: 1
Harbin Institute of Technology
Heilongjiang Sheng, China
Patent: 1
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